Leverantör: R.E.D. Shopping
High-Temp Polyimide BGA Tape – Thermal Insulation for PCB & 3D Printing
Beskrivning
🔧 Heat-proof. Stick-proof. Problem-proof. This polyimide adhesive tape is engineered for high-temperature applications — BGA soldering, PCB board protection, and 3D printer bed adhesion. Withstands extreme heat without leaving residue or losing grip.
- ✅ High-temp resistant — ideal for BGA & SMD soldering
- ✅ Thermal insulation for PCB board protection
- ✅ Perfect for 3D printer bed adhesion
- ✅ Clean removal — no sticky residue
- ✅ Precision-cut for easy application
💡 The tape pros trust. Because second chances in electronics are rare.
